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SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
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FORM 8-K
CURRENT REPORT
Pursuant to Section 13 or 15(d) of the
Securities Exchange Act of 1934
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Date of Report (Date of earliest event reported): May 12, 2003
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VICOR CORPORATION
(Exact name of Registrant as specified in charter)
Delaware 0-18277 04-2742817
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(State or other jurisdiction (Commission file number) (IRS employer
of incorporation) identification no.)
25 Frontage Road, Andover, Massachusetts 01810
(Address of principal executive offices) (Zip Code)
(978) 470-2900
(Registrant's telephone number, including area code)
N/A
(Former name, former address and former fiscal year, if changed since last
report)
Item 7. Exhibits.
(c) Exhibits. The following exhibit is being furnished herewith:
Exhibit
Number Title
99.1 Vicor Corporation's press release dated May 12, 2003.
Item 9. Regulation FD Disclosure.
On May 12, 2003, Vicor Corporation (the "Company") issued a press release
introducing the first family of products based on its new V I Chip Factorized
Power Architecture (FPA). The full text of that press release is attached as
Exhibit 99.1 hereto and incorporated by reference herein.
The Company is furnishing the information included as Exhibit 99.1 to this
report pursuant to Regulation FD. This information is being furnished pursuant
to Item 9 of this Current Report on Form 8-K and shall not be deemed to be
"filed" for the purposes of Section 18 of the Securities Exchange Act of 1934,
as amended, or otherwise subject to the liabilities of that section and will not
be incorporated by reference into any registration statement filed by the
Company under the Securities Act of 1933, as amended, unless specifically
identified therein as being incorporated therein by reference. This report will
not be deemed an admission as to the materiality of any information in the
report that is required to be disclosed solely by Regulation FD.
[Remainder of page left blank intentionally]
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SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934,
the registrant has duly caused this report to be signed on its behalf by the
undersigned hereunto duly authorized.
VICOR CORPORATION
Dated: May 12, 2003 By: /s/ Mark A. Glazer
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Name: Mark A. Glazer
Title: Chief Financial Officer
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EXHIBIT INDEX
Exhibit
Number Title
99.1 Vicor Corporation's press release dated May 12, 2003.
4
Exhibit 99.1
Vicor Unveils V-I Chip Bus Converters; Raises Bar for Power Density,
Efficiency and Speed in Intermediate Bus Architecture Applications
ANDOVER, Mass.--(BUSINESS WIRE)--May 12, 2003--Vicor Corporation
(NASDAQ: VICR) today has introduced the first family of products based
on its new V-I Chip ball grid array (BGA) surface mount (SMD) power
component. The new family consists of 48V to 12V Bus Converter Modules
(BCM) for conventional Intermediate Bus Architecture (IBA)
applications. The V-I Chip BCMs provide breakthrough performance
relative to classic brick bus converters at a fraction of the cost.
The V-I Chips (VICs) of Factorized Power, a disruptive technology
recently launched by Vicor, can process up to 200 Watts in a small and
light power BGA package. VICs are functional building blocks deployed
as SMD components to create a flexible factorized power system.
Conventional IBA applications are supported by narrow input range VIC
models.
The 200 Watt BCM Model B048K120T20 requires only 0.85 x 1.26 inch
(21.5 x 32 mm) of board space, less than 1/3 the board area of
intermediate bus converters in Quarter Brick style packages. Available
in two mounting styles, it has an above-the-board height of only 4 mm
(in-board mounting) or 6 mm (on-board mounting). Power density is 800
Watt/in3, five times better than Quarter Brick bus converters. And,
unlike conventional switching regulator ICs, BCMs do not require
external parts to perform their function. The B048K120T10, rated at
100 Watt, and B048K120T15, rated at 150 Watt, support lower power
applications in the same VIC package.
Efficiency exceeds 96% over a wide load range. The V-I Chip BGA
power component is easily cooled through its Junction-to-Case and
Junction-to-BGA thermal paths. The 100 Watt B048K120T10 requires no
discrete heat sink in a typical application with 200 LFM of 55 deg.C
air. The B048L120T20, with its optional integral pin fins, is capable
of full load operation at 200 Watt with 300 LFM of 80 deg.C air.
The V-I Chip BCMs have exceptional speed and transient
performance, responding to 100% step load changes in less than 1
microsecond. BCMs reduce or eliminate the need for costly and
life-limited tantalum or aluminum electrolytic bypass capacitors
required to hold up the output of low frequency, low bandwidth bus
converter bricks that are as much as 100 times slower, thus providing
further savings in board space and total system cost.
Employing a unique ZCS/ZVS topology with a fixed, multi-megahertz
switching frequency, V-I Chip BCMs are relatively free of input and
output noise, eliminating costly and bulky input filters.
The V-I Chip BCM power component is designed for surface mounting
and is compatible with standard re-flow soldering processes, as
commonly utilized for 1 mm pitch BGA or other contemporary SMD
packages, thus avoiding the separate through-hole soldering operation
required of classic bricks.
"V-I Chip BCMs provide unrivaled performance while significantly
reducing the cost-per-Watt of power conversion, at both the component
and system levels," said Andrew Hilbert, Senior Director of Product
Marketing. "BCMs are the first V-I Chip products to incorporate an
array of disruptive power conversion technologies which will supersede
the power paradigm based on the DC-DC converter brick that Vicor
pioneered in 1984. VICs will get bricks off the board."
V-I Chip Bus Converter Modules are priced as low as 12 cents/Watt
in OEM quantities and will be shipped in JEDEC trays or taped and
reeled for automated pick and place. Delivery is 6 weeks A.R.O.
Pre-assembled evaluation boards are available for $49 and will include
the BCM of your choice. Please specify by suffixing the Model Number
with "-EB".
For a Data Sheet, a performance comparison and other information
on the BCM, V-I Chips and Factorized Power Architecture, please visit
the Vicor website at www.vicorpower.com. To order, contact Vicor
Express at 800-735-6200 or e-mail vicorexp@vicr.com.
This press release contains certain forward-looking statements as
that term is defined in the Private Securities Litigation Reform Act
of 1995. You can identify these statements by our use of the words
"may," "will," "would," "should," "plans," "expects," "anticipates,"
"believes," "is designed to," "continue," "estimate," "project,"
"intend," and similar expressions. These forward-looking statements
involve risks and uncertainties that could cause actual results to
differ materially from those projected or anticipated. These risks and
uncertainties include our ability to develop new products
cost-effectively and our ability to decrease manufacturing costs, as
well as those risks and uncertainties identified in the Company's
Annual Report on Form 10-K. The risk factors contained in the Annual
Report on Form 10-K may not be exhaustive. Therefore, the information
contained in that Form 10-K should be read together with other reports
and documents that the Company files with the SEC from time to time,
which may supplement, modify, supersede or update those risk factors.
CONTACT: Technical Contact :
Vicor Corporation
Andrew Hilbert, Senior Director, Product Marketing
978/749-3292
or
Editorial Contact :
Vicor Corporation
Iris Kimber, Strategic Marketing Manager
978/749-3396
ikimber@vicr.com