Vicor's Power-on-Package System Provides up to 1,000A Peak Current
Enables Higher XPU Performance
ANDOVER, Mass.,
Power-on-Package modules build upon Factorized Power Architecture (FPA) systems deployed in high performance computers and large scale datacenters. FPA supports efficient power distribution and direct conversion from 48V to sub-1V XPUs. With current multiplication deployed in close proximity to high current processors, PoP MCMs overcome previous barriers to improved performance.
A pair of MCM4608S59Z01B5T00 (MCMs) and a MCD4609S60E59H0T00 Modular Current Multiplier Driver (MCD) provide 600A continuous and up to 1,000A peak at up to 1V. Owing to their high density, low profile package (46 x 8 x 2.7mm) and low noise attributes, Modular Current Multipliers (MCMs) are suitable for co-packaging within the XPU substrate or adjacent to it. Close proximity to the XPU eliminates substantial power loss and bandwidth limitations incurred in the “last inch” of the current delivery path from the boundaries of 12V multi-phase regulators.
Learn more about Power on Package Technology.
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About
Headquartered in Andover, Massachusetts,
Power Component Design Methodology
Vicor’s Power Component Design Methodology enables power system designers to reap all of the benefits of modular power component design – predictable component and system functionality and reliability, fast design cycles, and easy system configurability, re-configurability and scaling – while achieving system operating efficiency, power density and economy that rival the best alternative solutions. Utilizing Vicor’s Power System Designer, engineers can select from an extensive portfolio of proven Vicor power components to architect, optimize and simulate their complete power system, all the way from their input sources to their points of load. This innovative approach to power system design delivers fast time-to-market and state-of-the-art performance while minimizing the possibility of last minute surprises and delays that so often occur with conventional or custom design methodologies.
Vicor, FPA, MCM and MCD are trademarks of
Contact
Colin Boroski
508-475-0025 x 142
cboroski@rainiero.com
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Source: Vicor Corporation